TSLC wafer level LED packaging technology has significant advantages


LED Lighting Corporation Taiwan Semiconductor Lighting (tslc) offers high-cost LED lighting beads and a step-by-step approach to Taiwan's wafer-level LED aluminum nitride substrate packaging process, providing a cost-effective solution.

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Taiwan Semiconductor Lighting will hold a new factory completion and new product launch conference on December 20, and will publish unique advanced chip and inkjet phosphor coating technology to produce 3535, 5050, 6363 on 8-inch wafers. 7070 and 9090 specifications, the power of 1-55 watts, lens angle of 45, 60, 120 degrees and lensless flat silicone.
Wang Junxiong, general manager of Taiwan Semiconductor Lighting, and Lin Hanhan, director of marketing, said that tslc's 8-inch wafer-level mass production process is fast, stable, and excellent in uniform phosphor powder coating (Phosphorcoating) technology, fast (5 minutes / ()), the process yield rate is over 99 (can be compensated in-line monitoring). And improve the luminous efficiency of 15
The finished part of the 160-watt patio lamp is UL, CE, LM80 and DLC certified. The outdoor waterproof projection lamp has a power of more than 30 watts. It adopts a self-designed linear IC power supply, which is cost-effective.
Wang Junxiong said that tslc has a number of independent patents, and hopes to locate the high-end power lamp and module suppliers, with high flexibility and customized production capacity, connected in series to the upstream and downstream of the LED industry supply chain. Taiwan promotes the development of the LED lighting industry.

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